|
Layer£º |
4-46 |
|
Diameter of mechanical drilling |
Min. plating hole |
|
Line/Space on inner layer |
0.075 mm/0.075mm (H OZ)
0.075 mm/0.075mm (H OZ) |
|
Line/Space on outer layer |
0.1/0.1mm (1 OZ )
0.1/0.1mm (1 OZ ) |
|
Impedance |
+/- 10% |
|
Aspect Ratio |
Max: 12:1 |
|
Delivery Panel Size: |
Max. 570mm¡Á508mm Min£º50¡Á50mm |
|
Board Thickness |
<128mil£¨3.2mm£© |
|
Core Material Thickness |
Min. 0.1mm |
|
Pitch |
Min. Distance between SMT pads : 0.3mm
Min. Distance between BGA: 0.45mm |
|
Board Thickness: |
¡À10% £¨Thickness¡Ý0.8mm£©
¡À0.1mm £¨Thickness£¼0.8mm£© |
|
Base copper thickness on inner layer |
H~6 OZ |
|
Outer layer copper thickness |
T~2Oz Multilayer
T~5Oz Double sided |
|
Etching tolerance of inner/outer layer |
¡À20% |
|
Hole diameter tolerance |
¡À 0.05mm for NPTH
¡À0.075mm for PTH |
|
Tolerance for hole position |
¡À0.075 mm |
|
Hole wall roughness (Max) |
0.050mm |
|
Size for plated abnormal (Max) |
4.5*6.0mm |
|
Drilled long slot size (Min.) |
0.5mm |
|
Shape tolerance for drilled long slot |
Width tolerance: +/-0.05mm
Length tolerance: +0.05/-0.075mm |
|
Long slot position tolerance |
+/-0.1mm |
|
Hole distance ( different nets) |
MIN£º0.5mm |
|
Hole wall copper thickness (via) |
¡Ý25um |
|
Average copper thickness in holes |
30um |
|
Layer Misalignment |
0.1mm |
|
Hole position precision on outer pattern £¨Min£© |
¡À0.075 mm |
|
Tolerance from pattern to pattern (min) |
¡À0.05mm |
|
Min. Misalignment for solder mask |
¡À0.035mm |
|
Solder mask thickness |
Min£º10um(on line)
5um (on shoulder edge) |
|
Min. Solder mask bridge width |
0.08mm |
|
Hole diameter for plugged hole |
0.2mm~0.65mm |
|
Plugging of board with solder mask on 2 sides: min. |
80% |
|
Tin thickness for HASL |
1~40um |
|
Nickel thickness for immersion gold |
3~8um |
|
Gold thickness for immersion gold |
0.05~0.1um |
|
OSP thickness |
0.2~0.4um |
|
Text in Solder mask |
Height: 1.0mm Width: 0.15mm |
|
Legend Printing |
Height£º0.8 mm Width£º0.8 mm |
|
Impedance Controlled |
+/- 10% |
|
Surface Treatment |
Hot Air leveling (HASL), HASL Lead-free, immersion gold, plated
hard gold, OSP (Organic Solder Protection), Immersion
Silver£¬flash gold
Immersion Gold + OSP, plated gold + immersion gold |
|
Contour tolerance |
¡À0.1mm |
|
Min Routed arc for inner angle |
0.4mm |
|
Min. distance from pattern to routed edge |
0.25mm |
|
Depth tolerance for deep routing |
+/-0.15mm |
|
V Cut Angle: |
15¡ã/25¡ã/30¡ã/60¡ã |
|
Angle tolerance for V-Cut |
¡À10¡ã |
|
Board Thickness for V-Cut |
0.5mm~ 2.4 mm |
|
E-Test condition: |
50-300V |
|
Isolation resistance: |
With test adapter: 2M¦¸-100M¦¸ |
|
Conductive resistance: |
|
|
Density of test grid: Min. |
50 mil |
|
Pitch for test pad: Min |
for test with adapter 14mil
for test with flyer test 4mil |
