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HD-MC04 Aluminum-based PCB Technical Data sheet
Test base :
HD-MC04 Aluminum-based PCB
Thickness of copper：35um
Dielectric layer : 120um-130um
Cu base： 1.6mm
The result of the test：
|
No |
Test item |
U. |
Assay |
|
1 |
Peel Strength |
A |
N/mm |
1.5 |
|
After thermal stress（260℃） |
N/mm |
1.3 |
|
2 |
Blister test After Thermal stress |
／ |
（288℃，2min）
No Delamination，No blister |
|
3 |
Thermal resistance |
℃/W |
0.45 |
|
4 |
Thermal-conductive Factor |
W/m·k |
2.2 |
|
5 |
Flammability（A） |
／ |
FV-0 |
|
6 |
Surface Resistivity |
A |
MΩ
|
3.68×107 |
|
Constant humidity treatment（25℃～65℃，
RH：90%～98%，20 circulate） |
3.39×106 |
|
7 |
Volume Resistivity |
A |
MΩ
|
4.2×108 |
|
Constant humidity treatment（25℃～65℃，
RH：90%～98%，20 circulate） |
3.17×107 |
|
8 |
Dielectric Breakdown AC（leakage 5mA） |
KV |
6 |
|
9 |
Dielectric constant（1MHZ）（40℃，93%，96h） |
／ |
4.24 |
|
10 |
Dielectric dissipation factor
（1MHZ）（40℃，93%，96h） |
／ |
0.03 |
|
11 |
CTI |
V |
600 |
|
12 |
Operating Breakdown (AC) |
V |
500 |
|
13 |
Glass transition |
℃ |
125 |
|
14 |
Thickness |
um |
120 |
Method Description
1- Optical 2- Internal TO-220 test RD2018 3- Calculation from ASTM 5470
4-Extended ASTM 5470 5-ASTM D149 6-ASTM D150 7-Internal MDSC test RD2014
8-UL 746E 9-ASTM D2861 10- CPCA 4105-2010
Note: For applications with an expected voltage over 480 Volts AC,
HUADING recommends a dielectric thickness greater than 0.003”(76um)
Note: Maximum test voltage is a function of material and circuit
design.Typical proof test not represent the maximum.
Note: Circuit design is the most important consideration for determining
safety agency compliance.
HD-MC06 Aluminum-based PCB Technical Data sheet
Test base :
HD-MC06 Aluminum-based PCB
Thickness of the copper：35um
Dielectric layer:120um-130um
Thickness of the aluminum-base： 1.6mm
The result of the test：
|
No |
Test item |
U. |
Assay |
|
1 |
Peel strength |
A |
N/mm |
1.4 |
|
After thermal stress（260℃） |
N/mm |
1.2 |
|
2 |
Blister test After Thermal stress |
／ |
（300℃，2min）
No Delamination, No Blister |
|
3 |
Thermal resistance |
℃/W |
0.4 |
|
4 |
Thermal-conductive Factor |
W/m·k |
2.5 |
|
5 |
Flammability（A） |
／ |
FV-0 |
|
6 |
Surface Resistivity |
A |
MΩ
|
3.5×107 |
|
Constant humidity treatment（25℃～65℃，
RH：90%～98%，20
circulate） |
3.38×106 |
|
7 |
Volume Resistivity |
A |
MΩ
|
4.3×108 |
|
Constant humidity treatment（25℃～65℃，
RH：90%～98%，20
circulate） |
3.2×107 |
|
8 |
Dielectric Breakdown AC（leakage
5mA） |
KV |
6 |
|
9 |
Dielectric constant （1MHZ）（40℃，93%，96h） |
／ |
4.1 |
|
10 |
Dielectric dissipation factor（1MHZ）（40℃，93%，96h） |
／ |
0.031 |
|
11 |
CTI |
V |
600 |
|
12 |
Operating Breakdown (AC) |
V |
500 |
|
13 |
Glass transition |
℃ |
130 |
|
14 |
Thickness |
Um |
120 |
Method Description
1- Optical 2- Internal TO-220 test RD2018 3- Calculation from ASTM 5470
4-Extended ASTM 5470 5-ASTM D149 6-ASTM D150 7-Internal MDSC test RD2014
8-UL 746E 9-ASTM D2861 10- CPCA 4105-2010
Note: For applications with an expected voltage over 480 Volts
AC,HUADING recommends a dielectric thickness greater than 0.003”(76um)
Note: Maximum test voltage is a function of material and circuit
design.Typical proof test not represent the maximum.
Note: Circuit design is the most important consideration for determining
safety agency compliance.
Plant
