SERIAL

Item

Technical Data

1

Layers

1

2

Cover plate type

XPC、FR-1、FR-4、CEM-1、CEM-3

3

Copper thickness

min

70 um

min

18 um, 35 um

4

Monthly capacity

20,000 m2

5

Production and processing dimensions

max

460*610mm

min

100*150mm

6

Finished board size

max

400*350mm

min

70*100mm

7

Processing thickness

max

3.20mm

min

0.80mm

8

Minimum line width

0.20mm

9

Minimum spacing

0.20mm

10

Minimum aperture

Drilling

0.30mm

Punching

0.60mm

11

Aperture tolerance

±0.05mm

12

Hole Tolerance

±0.05mm

13

Overall Accuracy

Milling shape

±0.20mm

Chong shape

±0.10mm

14

Minimum solder bridge

0.15mm

15

Hot song and bending

Not MSD

1.00%

MSD

0.75.%

16

Insulation resistance

1012ΩNormal

17

Electric strength

>1.3KV/mm

18

Current resistance

10A

19

Anti-peel strength

1.4N/mm

20

Solder Mask Abrasion

>4H

21

Thermal Shock

260℃ 10S

22

Flame-retardant grades

94V-0

23

Off test voltage

50-300V

24

Conductive Ink Resistance

<200Ω

25

Peel able Solder mask

Easy Peeling

26

Surface

OSP FLUX, HASL, GOLD, etc