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Welcome to huading-group

 

full flex pcb effect diagram

       

Technical Specification

Scope of products : Single-side FPC, double-side FPC, multilayer FPC, aluminum substrate, copper substrate, single-side hollowed-out FPC and double-side hollowed-out FPC

Thinnest substrate : Copper foil/PI film: 18/12.5 um 12/18um

Smallest wire width and distance : 0.05mm/0.05mm (2mil/2mil)

Smallest aperture : 0.25mm (10mil)

Resistance to flexural cracking : > 150,000 cycles

Etching tolerance : ¡À 0.5 mil

Tolerance for exposure and alignment : ¡À 0.05mm (2mil)

Tolerance for projection punching : ¡À 0.025mm (1mil)

Tolerance for PI film alignment : < 0.10mm (4mil)

Tolerance for reinforcing and take alignment : < 0.1mm (4mil)

Maximum processing area : 25cm ¡Á 60cm for double side; 25 cm ¡Á 10000cm for single side; 25cm ¡Á 60cm for multilayer

Forming tolerance : ¡À 0.05mm

Mode of surface treatment :

Electroplated guiding : 1-5u "

Chemical gilding : 1-3u "

Pure electroplating tine : 4-20u "

Chemical tin : 1-5u "

Antioxidatio n (OSP) 6-13u"

Plant

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The production process : full flex pcb

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