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full flex pcb effect diagram
Technical Specification Scope of products : Single-side FPC, double-side FPC, multilayer FPC, aluminum substrate, copper substrate, single-side hollowed-out FPC and double-side hollowed-out FPC Thinnest substrate : Copper foil/PI film: 18/12.5 um 12/18um Smallest wire width and distance : 0.05mm/0.05mm (2mil/2mil) Smallest aperture : 0.25mm (10mil) Resistance to flexural cracking : > 150,000 cycles Etching tolerance : ¡À 0.5 mil Tolerance for exposure and alignment : ¡À 0.05mm (2mil) Tolerance for projection punching : ¡À 0.025mm (1mil) Tolerance for PI film alignment : < 0.10mm (4mil) Tolerance for reinforcing and take alignment : < 0.1mm (4mil) Maximum processing area : 25cm ¡Á 60cm for double side; 25 cm ¡Á 10000cm for single side; 25cm ¡Á 60cm for multilayer Forming tolerance : ¡À 0.05mm Mode of surface treatment : Electroplated guiding : 1-5u " Chemical gilding : 1-3u " Pure electroplating tine : 4-20u " Chemical tin : 1-5u " Antioxidatio n (OSP) 6-13u" Plant
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The production process : full flex pcb
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